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SMT Knowledge
SMT Basic Glossary

A

Accuracy (Accuracy): measurement results and the difference between the target value.
Additive Process (additive process): A method of manufacturing PCB conductive wiring, by selective precipitation in the plate layer of conductive material (copper, tin, etc.).
Adhesion (Adhesion): similar to the attraction between molecules.
Aerosol (gas solvent): small enough to air-borne particles of liquid or gas.
Angle of attack (angle of attack): Screen scraper plane surface and the angle between the screen printing.
Anisotropic adhesive (Anisotropic plastic): a conductive material, its particles only in the Z axis through the current.
Annular ring (ring ring): drilling around the conductive material.
Application specific integrated circuit (ASIC application-specific integrated circuit): Customers will have done for the special purpose circuit.
Array (array): a group of elements, such as: solder balls, according to the ordered ranks.
Artwork (wiring diagram): PCB conductive wiring diagram, used to generate original photographs can be produced in any proportion, it is generally 3:1 or 4:1.
Automated test equipment (ATE automatic test equipment): In order to assess performance levels, designed for automatic analysis functions or static parameters of the equipment, but also for fault isolation.
Automatic optical inspection (AOI Automatic Optical Inspection): In the automated system, and with the camera to check the model or object.

B

Ball grid array (BGA ball grid array): IC packaging, its input and output point is the component surface by the end of the solder ball grid array pattern.
Blind via (blind access hole): PCB between the outer and inner conductive connection, do not continue to pass to the board the other side.
Bond lift-off (weld lift-off): the welding pin from the pad surface (circuit board substrate) separated from the fault.
Bonding agent (adhesive): The formation of single-layer adhesive laminate of the adhesive.
Bridge (tin Bridge): should be conductive to connect the two conductors to connect the solder, causing short circuit.
Buried via (buried in the access hole): PCB between two or more inner layer of conductive connection (that is, invisible from the outer layer).

C

CAD / CAM system (Computer-Aided Design and Manufacturing System): Computer-aided design is the use of specialized software tools to design printed circuit structure; computer-aided manufacturing to convert this design into actual products. These systems include data processing and storage for large-scale memory, for the design of creative input and the stored information into graphics and reporting output device
Capillary action (capillary action): to make the molten solder, going against gravity, in the separated flow close to solid surface a natural phenomenon.
Chip on board (COB board chips): A hybrid technology, which uses the face of the chip components on the stalemate, traditionally through the fly line has been designed to connect in the basal layer circuit board.
Circuit tester (circuit test machine): A time of volume production test PCB method. Include: needle-bed, component-pin footprint, orientation probe, internal traces, load board, the empty plate, and component testing.
Cladding (coating): a thin layer of metal foil bonded on-board conductive layer formed on PCB layout.
Coefficient of the thermal expansion (thermal expansion coefficient): When the material surface temperature increases, the measured temperature of material per unit of expansion per million (ppm)
Cold cleaning (cold wash): an organic process of dissolution, liquid contact with the residue removal after the completion of welding.
Cold solder joint (cold solder points): a reflection of the role of insufficient wet weld, characterized by that, because of inadequate heating or clean properly, look gray, porous.
Component density (component density): PCB divided by the number of components on the board area.
Conductive epoxy (conductive epoxy resin): a polymer material, by adding metal particles, usually silver, so that through the current.
Conductive ink (conductive ink): In the thick film materials for use glue to form a PCB conductive wiring diagram.
Conformal coating (conformal coating): A thin protective coating applied to obey assembly shape PCB.
Copper foil (copper foil): A Qualitative Yin electrolytic material, precipitation in the basal layer on the circuit board layer thin, continuous metal foil, the conductive body as a PCB. It is easy to glue on the insulating layer, accepting print protective layer formed after the circuit-like corrosion.
Copper mirror test (copper mirror test): A flux corrosion testing, the use of a vacuum deposition on glass film.
Cure (Baking curing): the physical nature of the material changes, by chemical reaction, or a pressure / no pressure on the thermal reaction.
Cycle rate (cycle rate): a component placement term is used to measure from the get to the board to locate and return the machine speed, also known as test speed.

D

Data recorder (datalogger): a specific time interval, from a thermocouple attached to the PCB measured, collecting temperature equipment.
Defect (Defect): components or circuit elements deviate from the normal acceptable identity.
Delamination (layered): lamellar separation and board layer and the separation between the conductive coating.
Desoldering (discharge welding): the demolition of welded components to be repaired or replaced, including through: The suction tin tin with a suction vacuum (solder suction) and thermo-pulling.
Dewetting (dewetting): molten solder prior coverage, after the recovery process, leaving an irregular residue.
DFM (design for the manufacture of sake): the most efficient way to produce a product, the time, cost, and available resources into account.
Dispersant (dispersing agent): a chemical, add water to the particles to increase its capacity.
Documentation (documentation): With regard to assembly of information, explanation of basic design concepts, components and materials, the type and quantity of specific manufacturing instructions and the latest version. The use of three types: the number of prototype and small runs, the standard production line and / or production volume, and those who specify the actual graphics for government contracts.
Downtime (Downtime): Equipment failure and not due to maintenance or production of a product.
Durometer (Hardness): Measurement of rubber or plastic scraper blade hardness.

E

Environmental test (environmental testing): 1 or a series of tests used to determine the external components for a given packaging or assembly of the structure, mechanical and functional integrity of the overall impact.
Eutectic solders (eutectic solder): two or more metal alloys with low melting point, when heated, the eutectic alloy changes directly from solid to liquid, rather than through the plastic phase.

F

Fabrication (): designing the assembly before the air board manufacturing process, a separate process, including laminated, metal plus / minus, drilling, plating, wiring and cleaning.
Fiducial (reference point): and circuit wiring diagram synthesis of one specific marker for machine vision, to find the wiring diagram of the direction and location.
Fillet (welding angle): In between the pad and the component pin formed by the solder connections. The solder joint.
Fine-pitch technology (FPT Fine pitch technology): surface mount components, packaging pin center spacing distance of 0.025 "(0.635mm) or less.
Fixture (Jig): Connection PCB to handle the machine center devices.
Flip chip (flip chip): a non-pin structure, generally contain the circuit module. Designed for use by an appropriate amount of solder balls located on the surface (covered by conductive adhesives), in electrical and mechanical connected to the circuit.
Full liquidus temperature (full liquefaction temperature): Solder maximum temperature of the liquid state level, the most suitable for a good wet.
Functional test (functional test): Simulation of its intended operating environment of the entire assembly of electrical test.

G

Golden boy (Gold sample): a component or circuit assembly, have been tested and know that functional specifications to be used by comparing the testing of other modules.

H

Halides (halide): containing fluorine, chlorine, bromine, iodine or astatine compounds. Is the flux in the catalyst part, because of its corrosive, must be removed.
Hard water (hard water): water containing calcium carbonate and other ions, may be gathered in a clean the inner surface of the device and cause obstruction.
Hardener (hardening agent): Add a chemical resin, making early curing, or curing agent.

I

In-circuit test (online testing): A by-component testing, to test the component placement and direction.

J

Just-in-time (JIT exactly on time): By directly into production before the supply of materials and components to production lines in order to bring inventory down to a minimum.

L

Lead configuration (pin appearance): From the component extends out conductor, since two kinds of mechanical and electrical connection point for all.
Line certification (production line to confirm): to confirm the order of the controlled production lines, which could be required to produce a reliable PCB.

M

Machine vision (machine vision): one or more of the camera, to help find parts center or improve the system component placement accuracy.
Mean time between failure (MTBF mean time between failures): the functioning of units is expected to be the average statistical time-lapse intervals, usually hourly basis, the results should indicate actual, estimated, or calculated.

N

Nonwetting (do not melt the wet): solder adhesion on metal surfaces is not a situation. Due to the pollution of the surface to be welded, non-wetting is characterized by a visible base metal exposed.

O

Omegameter (Omega table): An instrument used to measure the surface of plasma PCB residues, by the assembly immersed in a known high resistivity of alcohol and water mixture, then measured and recorded as caused by residual ions resistance decreased.
Open (Open): two electrical connection points (pins and pads) to become separated due to either insufficient solder, either connection point pin coplanarity poor.
Organic activated (OA organic activity): organic acid as a surfactant to help welding systems, water-soluble.

P

Packaging density (assembly-density): PCB to place components (active / passive components, connectors, etc.) quantity; expressed as low, medium or high.
Photoploter (photo plotter): a basic wiring diagram processing equipment, used in photographic film to produce original PCB wiring diagram (usually the actual size).
Pick-and-place (pick - mount devices): A programmable machine, there is a mechanical arm, from the automatic feeder pick-up components, move to a fixed point on the PCB to the right put in the right direction posted╬╗Í├.
Placement equipment (mount devices): Combining high speed and accurate positioning to put the paste on the PCB component of the machine, is divided into three types: SMD a large number of transfers, X / Y positioning and on-line transfer system, can be combined in order to adapt to the circuit components board design.

R

Reflow soldering (reflow soldering): through various stages: preheat, stability / drying, reflow peak and cooling, the surface mount components into the solder paste in order to achieve a permanent connection process.
Repair (repair): restoration of defects in assembly of the functional action.
Repeatability (reproducibility): precise objectives, the ability to return to properties. An assessment of processing equipment and its continuity indicators.
Rework (rework): It is incorrect assembly back to meet the specifications or contract requirements of an iterative process.
Rheology (Rheology): description of fluid flow, or viscosity and surface tension properties, such as solder paste.

S

Saponifier (saponification agent): an organic or inorganic ingredients and additives in aqueous solution primarily used by, for example cleaning agents can be dispersed to promote the removal of rosin and water soluble flux.
Schematic (schematic diagram): the use of symbols representative of the circuit layout of the map, including electrical connections, components and functions.
Semi-aqueous cleaning (not completely water cleaning): involves solvent cleaning, hot water washing and drying cycle technology.
Shadowing (Shadow): In the infrared reflow soldering, the component physical barrier from certain areas of energy, resulting temperature high enough to completely melt the phenomenon of solder paste.
Silver chromate test (Silver Chromate test): A qualitative, halide ions in RMA flux exists in the screening test. (RMA reliability, maintainability and availability)
Slump (Slump): In the template before post-curing screen printing, solder paste, glue and other materials from spreading.
Solder bump (solder balls): The solder ball material bonded in the passive or active components of the contact area, playing the role of the circuit pad connections.
Solderability (Solderability): In order to form a strong connection, conductor (pin, pad or trace) melt wet (which can be welded) capability.
Soldermask (solder): printed circuit board processing techniques, in addition to solder the connection point outside of all surfaces covered by a plastic coating to live.
Solids (Solid): flux formula, the percentage by weight of rosin, (solid content)
Solidus (solid line): Some components of the solder alloy began melting (liquefaction) temperature.
Statistical process control (SPC Statistical Process Control): analysis using statistical techniques, the output results to guide its operations, adjustment and / or maintain quality control of the state.
Storage life (storage life): glue and maintain the usefulness of the storage time.
Subtractive process (negative procedure): To remove the conductive layer of metal foil or cover the choice of parts, to be the circuit wiring.
Surfactant (surface active agent): Add water to reduce surface tension to improve the wet chemicals.
Syringe (syringe): through its narrow opening of the adhesive drops out of the container.

T

Tape-and-reel (tape and disk): SMT components used in packaging, in a continuous section of the belt, the components into pits, the pit covered by a plastic tape in order to roll to the plate for SMT components machine.
Thermocouple (TC): from two different sensors made of metal, when heated in the temperature measurements to generate a small DC voltage.
Type I, II, III assembly (first, second and third assembly): board side or both sides of a surface-mount components PCB (I); a pin installed in the main surface components, there are SMD components mounted on one side or both sides of the hybrid technology (II); to passive SMD components installed on the second side, pin (hole) components installed on the main surface characterized by hybrid technology (III).
Tombstoning (component erected): A welding defects, chip component has been delegated to the vertical position, so that the other side do not weld.

U

Ultra-fine-pitch (ultra-fine-pitch): pin the center of the center distance and the conductor spacing 0.010 "(0.25mm) or smaller.

V

Vapor degreaser (steam cooking and oil-device): A cleaning system, an object hanging in the box, heating the solvent vapor condensation on the surface.
Void (void): tin-point inside the hole, in the back when the gas release or clamped before curing the formation of flux residues.

Y

Yield (output rate): the end of the manufacturing process used in production of components and submitted to the ratio of the number of components.

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