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Lead-free Manufacturing
Five steps to lead-free manufacturing process

At present, with regard to lead-free soldering materials and lead-free soldering process information has a lot of need to develop lead-free soldering process for the plant, the correct choice of such information, and combine them organically is very important. To develop a robust, high-qualified product rate of lead-free soldering production line, the need for careful planning, and to make efforts for the implementation of the plan as well as strict monitoring processes to ensure product quality and making the process under control. With many of these controls related to the change, such as materials, equipment, compatibility issues, pollution problems, statistical process control (SPC) program
And so on.

Lead-free soldering materials, welding technology will have a serious impact. Thus, in the development of lead-free soldering process, the need for all relevant aspects of welding technology optimization. Georze Westby on the development of lead-free soldering processes five-step method of lead-free soldering processes contribute to the development and process optimization.

A selection of appropriate materials and methods

In the lead-free soldering process, the welding material choice is the most challenging. Because for lead-free soldering process for lead-free solder, solder paste, flux and so the choice of materials is the most crucial and most difficult. In selecting these materials, but also take into account the type of welded components, circuit board type, and their surface coating condition. Choice of these materials should be in their own research proved, the authority or documentation, or recommended, or have the use of experience. A list made of these materials to prepare for trial to test the craft in order to study them in depth to understand all aspects of its technology implications.

For the welding method, to the actual situation according to their own choice, such as the element type: surface mount components, through-hole components; circuit board of the situation; board components, the number and distribution and so on. For the surface mount components, welding requires the use of reflow soldering methods; for THT components, can be chosen according to wave soldering, dip soldering or spray method to carry out welding. Wave soldering is more suitable for block board (large) on the THT components, welding; dip soldering is more suitable for block board (small) or on-board local area THT components, welding; Bureau of spray flux is more suitable for individual components on the board or a small amount of THT components welding. Also, note that the lead-free soldering process is longer than that of leaded solder, and the required welding temperature must be high, this is due to the melting point of lead-free solder higher than that of leaded solder, and its infiltration sexual difference but also a number of reasons.

In the welding method a good choice, its the type of welding process on the set. Then we must choose according to welding equipment and related technological requirements of process control and process inspection equipment, or upgrade. Welding equipment and related welding equipment choice with the choice of materials, as is quite crucial.

2 determine the process route and process conditions

In the first step is completed, you can right choice of welding materials welding process test. Through testing to determine if process route and process conditions. During the trial, the need to select the list of welding materials sufficient tests in order to understand its characteristics and the impact on the process. The purpose of this step is to develop lead-free solder samples.

3 development of a sound welding technology

This step is a continuation of the second step. It is the second step in the process test the test data collected for analysis, thereby improving the materials, equipment or change the process under laboratory conditions in order to obtain a sound process. In this step would also like to clarify the lead-free alloy welding process that may arise from contaminated know how to prevent, measured characteristics of a variety of welding process capability (CPK) values, as well as the original tin / lead process for comparison. Through these studies, we can develop a welding inspection and testing procedures, but also to find some process control approach.

4. Also need to weld samples can * test to identify whether the quality of the product meet the requirements. If mainly the need to find out the reasons and be resolved, until it reaches the required date. * Once the welding products that can meet the requirements of lead-free soldering process development will be successful, this technology would make for large-scale production of a quasi-ready operation

Everything is ready, you can now shift from sample production to industrial production. At this point, we still need to process monitoring in order to maintain the process under control.

5 Control and Improvement Process

Lead-free soldering process is a dynamic stage. Factories must be alert to the various problems that may arise in order to avoid loss of control technology, but also need to continuously improve the process, so that product quality and compliance rates continue to improve crystal. For any lead-free soldering processes, the improvement of welding materials, and upgrading equipment, welding products, the performance can be improved.

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