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Lead-free solder lead-free solder of the national legislation, decrees and directives summary

* United States legislation
 
, Law already prohibited in paint, automobile fuel, food cans, automotive body solder, light bulbs and fixtures, pipe welding and the use of lead.
, Of lead solder in electronic products are still allowed to use: Nevertheless, the U.S. Environmental Protection Agency has asked the United States-related industries to reduce the use of hazardous materials. Lead has now been classified as hazardous materials.
, Solder electronic products recycling can be done, but it may be a significant cost.
, Outside groups have repeatedly put pressure on lifting of the use of lead. NEMI Lead-Free Association has set up a special working group to study the lead-alloy alternatives.
, NCMS
   In the 80 considered by the alloy material found three kinds of possible alternatives for lead alloy
   - There is no substitute for the informal
, If the lead content of alloys "0.2% can be considered to be lead-free
   (There is currently no formal definition)
, NEMI at APEX '00 will be Sn 95.5Ag3.9Cu0.6 (\ 0.2%) make provision for their candidate of choice for lead-free alloys.
, Intended for North American companies use to produce lead-free products in 2004.
, Spontaneously in 2004 on the basis of the total elimination of leaded products.
, To help change the industry standard lead-free products.
 
* Lead-free status of the issue in several states

, California
   - The latest annual inventory of toxic chemicals

, Connecticut
   - For the collection of recyclable items hold general permission to certain attitudes (early 2000)

, Florida
   - Some useful life of electronic products to achieve a pilot program

, New Jersey
   - Electronic product recycling pilot program (3 and 6 grade levels)

, South Carolina
   - On the statewide electronics recycling bill

* Japan and Europe, "International Lead-free soldering roadmap framework"

, In the November 2002 Summit of the lead-free launch.
, Involved SOLDERTEC Europe and Japan, JEITA (Japan Electronics and Information Technology Industries Association)
, Suggestions:
  - The end of 2004, the manufacturer should have a complete lead-free parts inventory.
  - Suggested that the industry adopted the "lead-free" products used in weight does not exceed 0.1% of the maximum allowable lead content standards.
, The EU WEEE (Waste Electrical and Electronic Equipment) and RHS (restrictions on waste electrical and electronic equipment in the Hazardous Substances) directive of the agreement.
, Ban on hazardous materials, the RHS has confirmed in the July 1, 2006 entered into force. The directive provides that after that date must be sold to European consumers are not lead-free products.
, In addition to the phased abolition of lead outside, RHS also provides for the phased abolition of products containing the following materials:
   - Cadmium
   - Mercury
   - Hexavalent chromium
   - Two kinds of brominated flame retardants
, Proposed the following timetable for the implementation of the manufacturer. Road map for the proposed timetable for the major manufacturers to be more than one year ahead of the deadline time, and other manufacturers can meet these requirements two years later.
, Components
   - Since the end of 2001 onwards should have some lead-free components.
   - To the end of 2003 should have a complete lead-free terminated components product line.
   - To the end of 2004 lead-free components should have a complete product line.
, Components:
   - 2002 end of the year began manufacturing lead-free soldering components.
   - The end of 2005 the total elimination of lead from products in use.
, Recommends a road map from the tin - silver - copper circuit board assembly consisting of solder alloy. Road map for the proposed industry-leading manufacturers to develop a system for labeling.
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